XKY PRECISION ELECTRONICSCore Manufacturing Capabilities
From standard to high-end, the full spectrum of board manufacturing
With advanced equipment and strict processes, we cover the full spectrum—from standard multilayer to high-frequency/high-speed, HDI any-layer, heavy-copper thermal and aluminum/FPC—with precise single-ended/differential impedance control for six high-reliability sectors.
Overview
On layers and precision: standard 1–20 layers, up to 32 for special processes; min trace/space 2.5mil, laser micro-via 0.075mm, enabling stable HDI any-layer interconnect and high-density routing.
On materials and finish: 10+ material types including FR-4, High-Tg, Halogen-free, Aluminum, Rogers RF and FPC; 8 surface finishes including ENIG, Imm. Silver, OSP, HASL, Gold Finger and ENEPIG for different soldering/storage scenarios.
On electrical performance: precise single-ended/differential impedance control (±10%), with stack-up design and TDR testing to ensure signal integrity for 5G, microwave/RF and high-speed digital applications.
Key Manufacturing Capabilities
Frequently Asked Questions
What impedance tolerance can you hold?
Standard ±10%, tightened further for critical high-speed cases; TDR impedance report provided on delivery.
Do you support HDI any-layer interconnect?
Yes. Laser micro-via and any-layer interconnect, min micro-via 0.075mm for miniaturized designs.
What is the max copper thickness?
Max finished copper 8oz for power/automotive lighting high-current thermal scenarios.
Which surface finishes are available?
ENIG, Imm. Silver, OSP, HASL, Gold Finger, ENEPIG and more—recommended by soldering/storage needs.
Need a custom proposal or quote?
A senior engineer will contact you within 1 business day with a professional proposal and exact quote.
Get a Quote